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Conference papers

Failure mechanisms and reliability of the Al-chip-metallization during power cycling

Abstract : This paper studies the failure mechanisms and the reliability of the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and thermo-mechanical Finite Elements simulations are performed. This study takes advantages of the numerical simulations to analyze in details plastic strains and crack growth in the chip-metallization under different Active Power Cycling conditions. Lifetime models are then deduced by correlating the experimentally obtained lifetime with the corresponding calculated plastic strains and crack growth criteria
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Conference papers
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https://hal-uphf.archives-ouvertes.fr/hal-03437325
Contributor : Mylène Delrue Connect in order to contact the contributor
Submitted on : Friday, November 19, 2021 - 6:39:14 PM
Last modification on : Saturday, November 20, 2021 - 3:49:07 AM

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  • HAL Id : hal-03437325, version 1

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Camille Durand, Markus Klingler, Daniel Coutellier, Hakim Naceur. Failure mechanisms and reliability of the Al-chip-metallization during power cycling. Congrès Français de Mécanique CFM2015, Aug 2015, Lyon, France. ⟨hal-03437325⟩

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