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Study of fatigue failure in Al-chip-metallization during power cycling

Abstract : This paper studies the failure mechanisms occurring in the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and thermo-mechanical Finite Elements simulations are performed. Simulations of electronic packages is really advantageous: power cycling tests are time consuming and ageing parameters difficult to monitor, whereas simulations allow a detailed study of stresses, plastic strain and even crack growth. A numerical sensitivity study, previously unseen, gives us important information about the influence of test parameters on the mechanical behavior of chip-metallization.
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Submitted on : Friday, November 26, 2021 - 11:30:17 AM
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Camille Durand, Markus Klingler, Daniel Coutellier, Hakim Naceur. Study of fatigue failure in Al-chip-metallization during power cycling. Engineering Fracture Mechanics, Elsevier, 2015, 138, pp.127-145. ⟨10.1016/j.engfracmech.2015.02.020⟩. ⟨hal-03450932⟩



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