Study of fatigue failure in Al-chip-metallization during power cycling
Résumé
This paper studies the failure mechanisms occurring in the chip-metallization of a new power module using a copper clip soldered on the top side of the chip, instead of aluminum wire bonds. Both power cycling tests and thermo-mechanical Finite Elements simulations are performed. Simulations of electronic packages is really advantageous: power cycling tests are time consuming and ageing parameters difficult to monitor, whereas simulations allow a detailed study of stresses, plastic strain and even crack growth. A numerical sensitivity study, previously unseen, gives us important information about the influence of test parameters on the mechanical behavior of chip-metallization.