Development of backing piezoelectric micromachined ultrasonic transducer (B-PMUT) 2D array

Xu-Bo Wang (1, 2) , You-Cao Ma (1, 2) , Le-Ming He (1, 3, 2) , Yan Wang (1, 2) , Wei-Jiang Xu (4, 3) , Antoine Riaud (1, 2) , Jun-Yan Ren (1, 2) , Jia Zhou (1, 2)

1 Fudan University [Shanghai]
2 State Key Laboratory of ASIC and System
3 IEMN - Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520
4 TPIA - IEMN - Transduction, Propagation et Imagerie Acoustique - IEMN

To improve the problem of narrow bandwidth and large crosstalk in high-frequency PMUT array, a PMUT device with a damping backing structure (B-PMUT) is proposed and realized. The device is a two-dimensional array of 8×16 elements with an element pitch of 75 µm. The results show that the bandwidth of the device with backing is more than doubled (63%) to that of without backing. The crosstalk level between two neighboring elements decreased from −13.4 dB to −17 dB.

Mots clés: pMUTs; 2D array; PDMS; Backing; Crosstalk

Domaines: Sciences de l'ingénieur [physics]

Xu-Bo Wang, You-Cao Ma, Le-Ming He, Yan Wang, Wei-Jiang Xu, et al.. Development of backing piezoelectric micromachined ultrasonic transducer (B-PMUT) 2D array. 2021 IEEE International Ultrasonics Symposium (IUS), Sep 2021, Xi'an, China. pp.1-4, ⟨10.1109/IUS52206.2021.9593679⟩. ⟨hal-03540999⟩