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Acoustic Characterization of Patterning Degradation during Wet Etching

Abstract : Photoresist degradation can occur during wet etching processes due to chemicals diffusion through the polymer. The adhesion of the resist is not guaranteed anymore and damage on the resist / material interface appears. This phenomenon is usually monitored by optical methods. However, invisible resist degradation cannot be detected and the physical nature of the resist / material modification remains unknown. A high-frequency acoustic echography method has been developed to overcome these problems and has been performed to study the apparition of blisters in a deep UV photoresist exposed to a Standard Clean 1 solution. This technique allows the quantitative detection of resist degradation even if blisters cannot be seen in the resist. It has also been found that gas pockets appear during blisters formation.
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Contributor : Mylène Delrue Connect in order to contact the contributor
Submitted on : Monday, February 7, 2022 - 3:45:10 PM
Last modification on : Tuesday, April 5, 2022 - 9:50:04 AM



Christophe Virgilio, Philippe Garnier, Mathieu Foucaud, Arnaud Devos, David Pinceau, et al.. Acoustic Characterization of Patterning Degradation during Wet Etching. ECS Transactions, Electrochemical Society, Inc., 2015, 69 (8), pp.185-190. ⟨10.1149/06908.0185ecst⟩. ⟨hal-03560465⟩



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