Skip to Main content Skip to Navigation
Poster communications

Performance and Crosstalk Evaluation of 2-D Array Piezoelectric Micromachined Ultrasonic Transducer with 3-D Finite Element Simulation

Le-Ming He 1, 2 Wei-Jiang Xu 1, 2 Wen-Juan Liu 1, 3 Xu-Bo Wang 4 Jia Zhou 4 Jun-Yan Ren 4 
2 TPIA - IEMN - Transduction, Propagation et Imagerie Acoustique - IEMN
IEMN-DOAE - Institut d’Électronique, de Microélectronique et de Nanotechnologie - Département Opto-Acousto-Électronique - UMR 8520
3 MAMINA - IEMN - Matériaux et Acoustiques pour MIcro et NAno systèmes intégrés - IEMN
IEMN-DOAE - Institut d’Électronique, de Microélectronique et de Nanotechnologie - Département Opto-Acousto-Électronique - UMR 8520
Abstract : Micro-machined ultrasonic transducer (MUT) arrays have their structure and fabrication technology fundamentally different to those of thickness mode piezoelectric transducers. Their performance needs to be modelled and optimized before MEMS fabrication process is engaged. A 3-dimentional finite element modeling (3-D FEM) analysis is established for the simulation of a 2-D 7×7 piezoelectric micromachined ultrasonic transducer (PMUT) array in its cavity and buffer structure. The main characteristics and parameters of the PMUT are calculated in frequency domain, in terms of the electrical impedance, resonant modes patterns, stress distribution, and in particular the cross talk between array elements, The method provides an efficient tool for the design and optimization of PMUT structures. A novel structure with double active layers PMUT is proposed and simulated with the FEM.
Complete list of metadata

https://hal-uphf.archives-ouvertes.fr/hal-03582413
Contributor : Kathleen TORCK Connect in order to contact the contributor
Submitted on : Monday, February 21, 2022 - 11:08:20 AM
Last modification on : Wednesday, March 23, 2022 - 3:51:35 PM

Identifiers

Citation

Le-Ming He, Wei-Jiang Xu, Wen-Juan Liu, Xu-Bo Wang, Jia Zhou, et al.. Performance and Crosstalk Evaluation of 2-D Array Piezoelectric Micromachined Ultrasonic Transducer with 3-D Finite Element Simulation. IEEE International Ultrasonics Symposium (IUS 2019), Oct 2019, Glasgow, United Kingdom. IEEE, pp.792-795, ⟨10.1109/ULTSYM.2019.8925676⟩. ⟨hal-03582413⟩

Share

Metrics

Record views

9