Multiphysics topology optimization for laminated busbars

Oriol Puigdellivol , Yvonnick Le Menach , Souad Harmand (1) , Damien Méresse (1) , Jean-Francois Wecxsteen

1 LAMIH - Laboratoire d'Automatique, de Mécanique et d'Informatique industrielles et Humaines - UMR 8201

Laminated busbars acquire significant importance even if they are a passive component in converters. Their flat and overlapped conducting layers allow good heat dissipation and reduced stray inductance. Topology optimization enables balancing the amount of copper used with the maximum temperature and stray inductance of the busbar.

Mots clés: Inductance; Optimization; Topology; Finite element analysis; Multichip modules; Copper; Temperature control

Domaines: Mécanique [physics.med-ph]

Oriol Puigdellivol, Yvonnick Le Menach, Souad Harmand, Damien Méresse, Jean-Francois Wecxsteen. Multiphysics topology optimization for laminated busbars. 2016 IEEE Conference on Electromagnetic Field Computation (CEFC), Nov 2016, Miami, United States. pp.1-1, ⟨10.1109/CEFC.2016.7816294⟩. ⟨hal-03438955⟩